Fine Pitch Solution

Current industry dies and pad sizes coming smaller and smaller, more durable and precise probe cards come into subsequence. SSTS^® technology had developed an enhanced cantilever probe card technology to meet the fine pitch requirements

SSTS^® technologies provide optional material probe for fine pitch applications, it reduces scrub length and increase the touchdowns dramatically 

Bond Pad Pitch:  ≤30μm in-line,

 ≤30x60μm 2 row stagger,

 ≤40x80μm 3 or 4 row stagger, 

Bond Pad Size:    ≤40x40μm pad size.

Bond Pad Material: Aluminum, Gold, C4 etc

Probe Wire Diameter: 2.5mil-5mil

Overdrive: ≤2mils

Probing Temperature (℃): -40 to 185